Inspection system grades solder balls The BGA II Inspection Package consists of machine-vision

The BGA II Inspection Package consists of machine-vision inspection software, a Cognex MVS-8100 PCI frame grabber, a Windows-based user interface, on-line documentation, and two calibration plates. It supports large-format, high-resolution cameras for the inspection of ball-grid arrays for missing, misplaced, or improperly formed solder balls at rates to 10,000/s. A built-in calibration feature can convert training and measurement parameters from pixels to physical units and correct for camera s
Sept. 1, 1999

Inspection system grades solder balls

The BGA II Inspection Package consists of machine-vision inspection software, a Cognex MVS-8100 PCI frame grabber, a Windows-based user interface, on-line documentation, and two calibration plates. It supports large-format, high-resolution cameras for the inspection of ball-grid arrays for missing, misplaced, or improperly formed solder balls at rates to 10,000/s. A built-in calibration feature can convert training and measurement parameters from pixels to physical units and correct for camera skew, optical distortion, and scaling. The Windows-based graphical device description editor enables users to train a variety of BGA, flip-chip, and chip-scale packages. An optional BGA illumination system is available.

Cognex Corp.

One Vision Dr.

Natick, MA 01760

(508) 650-3000

(508) 650-3333

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