Inspection system grades solder balls
The BGA II Inspection Package consists of machine-vision inspection software, a Cognex MVS-8100 PCI frame grabber, a Windows-based user interface, on-line documentation, and two calibration plates. It supports large-format, high-resolution cameras for the inspection of ball-grid arrays for missing, misplaced, or improperly formed solder balls at rates to 10,000/s. A built-in calibration feature can convert training and measurement parameters from pixels to physical units and correct for camera skew, optical distortion, and scaling. The Windows-based graphical device description editor enables users to train a variety of BGA, flip-chip, and chip-scale packages. An optional BGA illumination system is available.
Cognex Corp.
One Vision Dr.
Natick, MA 01760
(508) 650-3000
(508) 650-3333
