Teledyne Launches Linea ML 32K Camera for Ultra-High-Resolution Imaging
Key Highlights
- Delivers ultra-high-resolution imaging with 2.5 μm pixels and a maximum line rate of 150 kHz for precise wafer inspection.
- Features multiline CMOS sensor architecture supporting single-line, dual-line, trilinear, or quadlinear multispectral imaging configurations.
- Includes advanced features like HDR and sequential exposure to improve defect detectability and inspection accuracy.
WATERLOO, Canada, Sept. 29, 2026 – Teledyne DALSA, a Teledyne Technologies [NYSE: TDY] company and global leader in machine vision technology, today announced the release of its new Linea™ ML 32K line scan camera. Designed for ultra-high-resolution imaging in semiconductor wafer and electronics inspection, the Linea ML 32K camera joins the existing Linea ML family, delivering exceptional image quality with 2.5 µm pixels and a maximum line rate of 150 kHz.
The Linea ML family features a multiline CMOS sensor, available in 8k, 16k, and now 32k resolutions, with optimized quantum efficiency to meet the rigorous demands of current and future machine vision applications. Its multiline sensor architecture enables configuration for single-line, dual-line, trilinear color, or quadlinear multispectral imaging, depending on application requirements. Unique features such as sequential exposure provide versatility and flexibility to meet a variety of demanding requirements.
The small 2.5 µm pixel size makes the Linea ML 32K particularly well suited for inspecting entire 300 mm wafers using a single camera. Features such as HDR and sequential exposure significantly improve the detectability of small defects. The camera also includes Camera Link HS® CX4 connectors for Active Optical Cables, providing complete EMI immunity.
See Linea ML 32K live in action at VISION in Stuttgart, Germany, Oct. 6-8, 2026. Visit us in Hall 8, Booth 8B10, or contact us online for more information.
Teledyne Vision Solutions offers the world’s most comprehensive, vertically integrated portfolio of industrial and scientific imaging technology. Aligned under one umbrella, Teledyne DALSA, e2v CMOS image sensors, FLIR IIS, Lumenera, Photometrics, Princeton Instruments, Judson Technologies, Acton Optics, and Adimec form an unrivaled collective of expertise across the spectrum with decades of experience and best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest sensing and related technology portfolio in the world. Teledyne offers worldwide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.
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