Viscom AG (Hannover, Germany) and CyberOptics Corp. (Minneapolis, MN, USA) have entered into an OEM agreement to equip Viscom’s SPI inspection systems product line with CyberOptics’ 3-D SPI sensor technology. The development and supply agreement allows for the integration of CyberOptics SE500 sensor technology into the Viscom PCB inspection platforms, enabling high-speed 3-D solder paste inspection tasks.
CyberOptics has established itself in the surface-mount technology (SMT) market with more than 3000 3-D SPI systems sold. Viscom providesautomated optical inspection (AOI) and automated x-ray inspection (AXI) equipment to worldwide customers, particular within the automotive and industrial electronics markets.
“We thoroughly analyzed the market for 3-D sensor technology and discovered that CyberOptics’ sensor technology and engineering resources as well as their management experience in handling OEM sensor projects could provide the best matching solution for Viscom’s demanding product requirements,” says Volker Pape, co-founder of Viscom.
The first available Viscomelectronics inspection system with the CyberOptics SE500 sensor head is the Viscom S3088 SPI. After field testing is complete, Viscom expects production rollout of the S3088 SPI will start in June 2011.
-- Posted byVision Systems Design