Teledyne e2v has begun mass production of its new Emerald 12M and 16M CMOS image sensors designed for optical inspection and industrial automation. The sensors feature 2.8 µm low-noise global shutter pixels produced using a 110nm wafer manufacturing process. Teledyne e2V says that the smaller optical format will reduce the overall camera costs.
Both sensors utilize high-speed USB 3.1 gen 2, 10GigE, and Camera Link interfaces, HDR modes with up to 120dB dynamic range, and a ROI mode that allows multiple images under different exposure conditions to be captured in a single, high-res shot. The Emerald 12M and 16M sensors each also feature an identical CLGA package, optical center, readout structure, and processing. Standard and high-speed grades are available.
To Learn More:
Contact: Teledyne e2v
Headquarters: Chelmsford, Essex, UK
Product: Emerald 12M and 16M CMOS image sensors
Key Features: 2.8 µm low-noise global shutter pixels, high-speed USB 3.1 gen 2, 10GigE, and Camera Link interface systems, HDR modes with up to 120dB dynamic range, ROI mode allows multiple image capture in single high-res shot.
What Teledyne e2V says:
View more information on the Emerald 12M and 16M CMOS image sensors.