Siemens Acquires Canopus AI to Integrate AI-driven Metrology into Semiconductor Manufacturing

The acquisition of Canopus AI aims to enhance Siemens’ semiconductor digital thread by incorporating AI-powered wafer and mask inspection technologies aimed at improving precision and process control in advanced semiconductor fabrication.
Feb. 4, 2026
2 min read
Siemens
Siemens has acquired Canopus AI to expand its semiconductor design and manufacturing digital thread

Siemens has acquired Canopus AI to expand its semiconductor design and manufacturing digital thread by integrating additional cutting-edge metrology technologies, enhanced with advanced AI capabilities.

Siemens (Munich, Germany) has acquired Canopus AI (Grenoble, France), a company specializing in AI-driven metrology solutions for semiconductor wafer and mask inspection. This acquisition expands Siemens semiconductor design and manufacturing digital thread by adding Canopus AI's metrology technologies with AI capabilities.


Semiconductor manufacturing faces increased challenges as device geometries shrink and production volumes rise. Metrology plays a critical role in maintaining quality and yield. Canopus AI solutions, including AI-powered inspection and measurement tools, complement Siemens existing product portfolio.

Siemens
Canopus AI’s Machine Learning (ML) and AI technology for metrology and inspection measure edge placement error (EPE) to improve wafer manufacturing simulation models

Canopus AI’s Machine Learning (ML) and AI technology for metrology and inspection measure edge placement error (EPE) to improve wafer manufacturing simulation models.

Tony Hemmelgarn, president and CEO of Siemens Digital Industry Software, stated in a press release that combining Canopus AI’s metrology and inspection technologies with Siemens Calibre portfolio—which includes computational lithography and manufacturing physics simulation—will improve wafer pattern fidelity, accelerate yield ramp up, and reduce time to volume for advanced technology nodes. “This integration further advances our vision of a comprehensive, high-accuracy, semiconductor manufacturing digital twin, enabling sub-nanometer process control and mask development,” he said.

Siemens
Canopus AI’s web-based and mapbox style viewer for critical dimension scanning electron microscope (CD-SEM) images, HVM (High Volume Manufacturing) Oasis and metrology/inspection data review.

Canopus AI’s web-based and mapbox style viewer for critical dimension scanning electron microscope (CD-SEM) images, HVM (High Volume Manufacturing) Oasis and metrology/inspection data review.

Founded in 2021 and based in Grenoble, France, Canopus AI focuses on metrology and inspection workflows enhanced with AI. Their approach measures edge placement error (EPE) to improve wafer manufacturing simulation models. Their technology includes a web-based map box style viewer for critical dimension scanning electron microscope (CD-SEM) images and supports handling of pixel-to-vertex, native multigon curvilinear data for metrology and inspection.

Siemens
Canopus AI’s ecosystem--from pixel to vertex-based data handling, including support of native multigon curvilinear data.

Canopus AI’s ecosystem--from pixel to vertex-based data handling, including support of native multigon curvilinear data.

Joël Alanis, CEO of Canopus AI, noted in the press release that joining Siemens will allow broader access to AI-enabled metrology tools for semiconductor designers and manufacturers.

The acquisition was finalized on January 12, 2026.

About the Author

Sharon Spielman
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Sharon Spielman

Editor in Chief / Head of Content

Sharon Spielman joined Vision Systems Design in January 2026. She has more than three decades of experience as a writer and editor for a range of B2B brands, most recently as technical editor for VSD's sister brand Machine Design, covering industrial automation, mechanical design and manufacturing, medical device design, aerospace and defense, CAD/CAM, additive manufacturing, and more. 

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