APRIL 23--Cognex Corporation (Natick, MA; www.cognex.com), a supplier of machine-vision systems, has entered into an OEM agreement with Alphasem AG, a manufacturer of die-bonding and sorting equipment based in Berg/TG, Switzerland. Under the agreement, Alphasem expects to purchase approximately $1.3 million of Cognex's MVS 8100 machine-vision systems over the next 18 months.
Alphasem will integrate the Cognex vision systems into its Swissline 902x range of die-bonding and sorting equipment. Alphasem's Die Attach series of machines automatically attach semiconductor dice from wafers up to 300 mm in size to metal lead frames, organic substrates, and adhesive-based packages. The die-sorting machines sort dice into multiple tapes or trays. The Cognex vision systems inspect the bond site before the die is placed on it; guide a robotic gripper that picks up the die and accurately places it on the site; and inspect the die after it has been placed to ensure it has been properly bonded.